MECHANIC Lead-free low-temperature solder paste CPU repair solder paste BGA nand 138degree melting point rosin flux
JOD5.000
No tax
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Features:
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
Good soldering and welding tool
Specification:
Material: Plastic+solder paste
Color: As picture shown
Microns: 25-45um
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc
Solder paste lead solder at room temperature melting point 138 ℃ / forming fast and easy to weld conductive
Product information:
Lead solder paste, 138 ℃, the degree of melting point, easy welding, easy molding
Product Specifications:
V5B35 42g 138℃
Data sheet
- Height
- 39mm
- Width
- 32mm
- Weight
- 50G
- Melting Point
- 138C
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