MECHANIC Lead-free low-temperature solder paste CPU repair solder paste BGA nand 138degree melting point rosin flux

Features:

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on

Good soldering and welding tool

Specification:

Material: Plastic+solder paste

Color: As picture shown

Microns: 25-45um

Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc

Solder paste lead solder at room temperature melting point 138 ℃ / forming fast and easy to weld conductive

Product information:

Lead solder paste, 138 ℃, the degree of melting point, easy welding, easy molding

Product Specifications:

V5B35 42g             138℃