MECHANIC BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner 20ml BGA-IC Repair Remove Liquid Tool

1,usage: when using, cover the liquid with a small piece of cotton wool and then cover the BGA chip with sealant, then put the main board of the phone into a small plastic bag to seal, and place it horizontally for 20 minutes before doing it again. After the glue is softened, remove it carefully with the needle tool

2. Note: do not touch eyes or skin. Clear water can be used in case of contact.Seal the bottle cap after use, so as not to affect the effect of volatile proportion imbalance.The liquid in the bottle will produce gas. Please open it carefully,keep out of reach of children